Standards Used In PCB Assembly Process



The best manufacturer will be those who are well-versed in the industry standards for PCB Assembly. Some of these standards are those which are published by IPC, the Association Connecting Electronics Industries. In these standards, you can find detailed information on how a PCB should be manufactured, and how the manufacturing of the board should be documented. To be a best manufacturer it is necessary to incorporate those standards into all aspects of their operations.
IPC Standards Used in the Manufacturing of PCB

IPC is the official name of the association which produces PCB-related standards. The association was formerly called the Institute for Printed Circuits (hence the acronym "IPC"), but is presently called the Association  

Connecting Electronics Industries.
There are IPC standards for almost every phase of the PCB production process. To give you an idea of what these standards entail, here are a few examples.

F IPC-2581IPC-2581 is a generic standard used when sending information between a PCB designer and a manufacturer or assembly company. It provides a standardized format for exchanging design data that helps ensure consistent production results.

F IPC-2221IPC-2221 is a generic standard for the design of PCBs. Within the 2220 series, there are also specifications for specific types of PCBs such as rigid, flex and MCM-L. It addresses topics like design layout, parts lists, materials, mechanical and physical properties, electrical properties, thermal management and more.

F IPC-4101C: IPC-4101C covers requirements for base materials, typically called laminate, mostly for use with rigid or multilayer boards. It deals with the materials used, their dimensions and their properties.

F IPC-6012B: The Specification IPC-6012BThe specification establishes qualification and performance requirements for the fabrication of rigid PCBs. It offers requirements for the various types of product classes in areas such as structural integrity, solder ability and conductor spacing.
F J-STD-001IPC J-STD-001 describes the materials, methods and other criteria for creating high-quality soldered interconnections. It focuses on process control and lays out requirements for a range of electronic product types.

F IPC-TM-650: IPC has also published a test methods manual, IPC-TM-650, which provides guidelines for assessing various aspects of PCBs. For example, test method IPC-TM-650 2.6.14.1 describes methods for testing a board’s propensity for surface electrochemical migration. The test measures resistance to the flow of current across a PCB substrate surface. IPC-TM-650-2.3.25.1 describes a method for ionic cleanliness testing of bare printed wire boards, which is important because ionic contamination can cause issues that make a PCB defective.

F IPC-A-600GIPC-A-600G sets the acceptance criteria for PCBs. It describes which observable conditions of a board are acceptable and non-conforming — as well as the target conditions — for all parts of the PCB, from gold fingers to copper plating. It is the visual representation of the requirements put forward in other specifications

F IPC-A-610: IPC-A-610, Acceptability of Electronic Assemblies, provides criteria for the acceptance of end products. It is the most widely used standard the IPC publishes.

F IPC-A-620IPC-A-620 provides criteria for acceptability of cable, wire and harness assemblies and can serve as a stand-alone document for purchasing products.

F IPC/WHMA-A-620C: Requirements and Acceptance for Cables and Wire Harness Assemblies. This is used in the manufacturing of cables used in conjunction with your PCB assemblies.

F IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures. This standard is used when your CM assembles and inspects box builds.

F IPC 7711/7721C: Rework, Modification, and Repair of Electronic Assemblies. To repair and rework PCBAs to IPC standards, your manufactures will use the information from this document.
F IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards, now addresses board cleanliness. It defines the recommended requirements for the cleanliness of unpopulated single, double-sided and multilayer printed boards.

There are many other IPC specifications that apply to the assembly of printed circuit boards, but these are the primary ones that should be used Manufactures to ensure success on your boards.
Image given below shows a complete picture of IPC standards from start to finish.






IPC standards are the electronics-industry-adopted standards for design, PCB manufacturing, and electronic assembly.
There are several categories of printed circuits boards depending upon their uses, and speaking of Product Classes, IPC has adopted the following three classes:
F Class 1 – General Electronic Products: Includes products suitable for applications where the major requirement is the function of the completed assembly.

F Class 2 – Dedicated Service Electronic Products: Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically, the end-use environment would not cause failures.

F Class 3 – High Performance Electronic Products: Includes products where continued performance or performance-on-demand is critical, equipment downtime cannot be tolerated, and end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support systems and other critical systems.

To achieve high-quality, reliable products that meet customer expectations, it’s essential for companies involved in the production of PCBs and the products that use them to commit to quality through the use of IPC standards for printed circuit boards.
             Complying with IPC standards can help a company improve its processes and products in numerous ways. Here are four of the leading benefits.

F Improved Product Quality and Reliability

F Improved Communication

F Reduced Costs


F Improved Reputation and New Opportunities




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